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Features
■ Surface Mount Devices
■ Lead free device
■ Surface Mount packaging for automated
assembly
■ Agency recognition: UL
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Applications
Almost anywhere there is a low voltage power
supply, up to 60V and a load to be protected,
including:
■ Computer mother board, Modem. USB hub
■ PDAs & Charger, Analog & digital line card
■ Digital cameras, Disk drivers, CD-ROMs,
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SMD 0805 SERIES
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FU YUAN
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MODEL
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MARKING
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Vmax
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Imax
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Ihold
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Itrip
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Pd
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Maximum
Time To Trip
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Resistance
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(Vdc)
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(A)
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@25°C
(A)
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@25°C
(A)
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Max.
(W)
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Current
(A)
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Time
(Sec)
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Rimin
(Ω)
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R1max
(Ω)
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SMD0805-005SF
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1
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15.0
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30
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0.05
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0.15
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0.5
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0.5
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1.50
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1.500
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18.000
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SMD0805-010SF
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1
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15.0
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30
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0.10
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0.30
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0.5
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0.5
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1.50
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0.750
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6.000
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SMD0805-020SF
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2
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9.0
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30
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0.20
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0.50
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0.5
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8.0
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0.02
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0.550
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3.500
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SMD0805-035SF
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3
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6.0
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30
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0.35
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0.75
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0.5
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8.0
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0.10
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0.200
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1.200
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SMD0805-035SF12v
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3
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12.0
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30
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0.35
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0.75
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0.5
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8.0
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0.10
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0.200
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1.200
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SMD0805-050SF
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5
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6.0
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30
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0.50
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1.00
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0.5
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8.0
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0.10
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0.100
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0.850
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SMD0805-050SF12v
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5
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12.0
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30
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0.50
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1.00
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0.5
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8.0
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0.10
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0.100
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0.850
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SMD0805-050SF16v
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5
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16.0
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30
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0.50
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1.00
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0.5
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8.0
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0.10
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0.100
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0.850
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SMD0805-050SF24v
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5
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24.0
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30
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0.50
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1.00
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0.5
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8.0
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0.10
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0.100
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0.850
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SMD0805-075SF
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7
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6.0
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35
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0.75
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1.50
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0.6
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8.0
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0.20
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0.070
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0.385
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SMD0805-075SF12v
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7
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12.0
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35
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0.75
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1.50
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0.6
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8.0
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0.20
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0.070
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0.385
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SMD0805-100SF
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0
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6.0
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35
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1.00
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1.95
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0.6
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8.0
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0.30
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0.040
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0.230
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SMD0805-100SF12v
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0
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12.0
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35
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1.00
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1.95
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0.6
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8.0
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0.30
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0.040
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0.230
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SMD0805-110SF
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0
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6.0
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35
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1.10
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2.20
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0.6
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8.0
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0.30
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0.035
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0.210
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SMD0805-110SF12v
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0
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12.0
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35
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1.10
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2.20
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0.6
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8.0
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0.30
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0.035
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0.210
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SMD0805-125SF
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12
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6.0
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35
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1.25
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2.50
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1.5
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8.0
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0.60
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0.025
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0.140
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SMD0805-150SF
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15
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6.0
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35
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1.50
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3.00
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1.0
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8.0
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0.50
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0.015
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0.130
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Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
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Environmental Specifications
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Test
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Conditions
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Resistance change
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Passive aging
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+85°C, 1000 hrs.
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±5% typical
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Humidity aging
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+85°C, 85% R.H. , 168 hours
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±5% typical
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Thermal shock
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+85°C to -40°C, 20 times
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±33% typical
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Resistance to solvent
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MIL-STD-202,Method 215
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No change
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Vibration
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MIL-STD-202,Method 201
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No change
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Ambient operating conditions : - 40 °C to 85 °C
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Maximum surface temperature of the device in the tripped state is 125 °C
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AGENCY APPROVALS : U.L approved
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Ihold versus temperature
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Ihold versus temperature
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MODEL
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Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)
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-40°C
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-20°C
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0°C
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25°C
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40°C
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50°C
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60°C
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70°C
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85°C
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SMD0805-005SF
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0.070
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0.060
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0.055
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0.050
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0.040
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0.035
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0.030
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0.025
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0.015
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SMD0805-010SF
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0.14
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0.12
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0.11
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0.10
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0.08
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0.07
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0.06
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0.05
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0.03
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SMD0805-020SF
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0.28
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0.25
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0.23
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0.20
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0.17
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0.14
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0.12
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0.10
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0.07
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SMD0805-035SF
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0.47
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0.44
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0.39
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0.35
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0.30
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0.27
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0.24
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0.20
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0.14
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SMD0805-050SF
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0.68
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0.62
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0.55
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0.50
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0.40
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0.37
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0.33
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0.29
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0.23
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SMD0805-075SF
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1.00
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0.90
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0.79
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0.75
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0.63
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0.57
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0.53
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0.41
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0.34
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SMD0805-100SF
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1.35
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1.25
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1.15
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1.00
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0.82
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0.74
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0.65
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0.55
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0.42
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SMD0805-110SF
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1.45
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1.35
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1.20
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1.10
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0.92
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0.84
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0.75
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0.65
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0.52
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SMD0805-125SF
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1.65
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1.53
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1.36
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1.25
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1.05
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0.95
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0.85
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0.74
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0.59
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SMD0805-150SF
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1.98
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1.84
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1.63
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1.50
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1.26
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1.14
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1.02
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0.88
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0.71
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Construction and Dimension (Unit:mm)
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MODEL
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A
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B
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C
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D
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E
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Min.
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Max.
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Min.
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Max.
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Min.
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Max.
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Min.
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Min.
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SMD0805-005SF
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2.00
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2.20
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1.20
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1.50
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0.40
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0.90
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0.20
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0.10
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SMD0805-010SF
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2.00
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2.20
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1.20
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1.50
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0.40
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0.90
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0.20
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0.10
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SMD0805-020SF
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2.00
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2.20
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1.20
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1.50
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0.35
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0.80
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0.20
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0.10
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SMD0805-035SF
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2.00
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2.20
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1.20
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1.50
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0.35
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0.80
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0.20
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0.10
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SMD0805-035SF12v
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2.00
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2.20
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1.20
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1.50
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0.35
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0.80
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0.20
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0.10
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SMD0805-050SF
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2.00
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2.20
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1.20
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1.50
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0.35
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0.80
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0.20
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0.10
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SMD0805-050SF12v
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2.00
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2.20
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1.20
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1.50
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0.35
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0.80
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0.20
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0.10
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SMD0805-050SF16v
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2.00
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2.20
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1.20
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1.50
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0.50
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1.10
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0.20
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0.10
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SMD0805-050SF24v
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2.00
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2.20
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1.20
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1.50
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0.50
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1.10
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0.20
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0.10
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SMD0805-075SF
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2.00
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2.20
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1.20
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1.50
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0.50
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1.00
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0.20
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0.10
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SMD0805-075SF12v
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2.00
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2.20
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1.20
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1.50
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0.50
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1.00
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0.20
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0.10
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SMD0805-100SF
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2.00
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2.20
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1.20
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1.50
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0.70
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1.20
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0.20
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0.10
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SMD0805-100SF12v
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2.00
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2.20
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1.20
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1.50
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0.70
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1.20
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0.20
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0.10
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SMD0805-110SF
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2.00
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2.20
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1.20
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1.50
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0.70
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1.20
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0.20
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0.10
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SMD0805-110SF12v
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2.00
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2.20
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1.20
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1.50
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0.70
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1.20
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0.20
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0.10
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SMD0805-125SF
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2.00
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2.20
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1.20
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1.50
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0.70
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1.50
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0.20
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0.10
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SMD0805-150SF
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2.00
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2.20
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1.20
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1.50
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0.70
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1.50
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0.20
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0.10
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Termination pad characteristics
Terminal pad materials： Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Rework
Use standard industry practices, the removal device must be replaced with a fresh one.
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Thermal derating curve
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Typical time-to-trip at 25°C
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!WARNING
· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when
repeatedfault conditions or prolonged trip events are anticipated.
· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,
thermal, andmechanical procedures for electronic components.
· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of thedevices. PPTC SMD can be cleaned by standard methods.
· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board
layouts orreflow profile could negatively impact solderability performance of our devices.
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‧Recommended reflow methods：IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the
bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm
(0.010 inch).
‧Devices can be cleaned using standard method and
solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
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Tape and reel specifications (mm)
Governing Specifications EIA 481-1
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W
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8.15 ± 0.3
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P0
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4.0 ± 0.10
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P1
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4.0 ± 0.10
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P2
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2.0 ± 0.05
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A0
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1.95 ± 0.10
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B0
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3.45 ± 0.10
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B1max.
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4.35
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D0
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1.5 + 0.1, -0
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F
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3.5 ± 0.05
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E1
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1.75 ± 0.10
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E2min.
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6.25
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T
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0.6
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T1max.
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0.1
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K0
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0.74±0.1
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Leadermin.
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390
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Trailermin.
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160
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Reel Dimensions
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A max.
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178
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N min.
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60
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W1
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9 ± 0.5
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‧ Storage conditions：40°C max, 70% R.H.
‧ Devices may not meet specified performanc if storage conditions are exceeded.
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Order information Packaging
SMD0805 010 SMD：surface mount device Current 0.10A Tape & Reel Quantity 5,000 pcs/reel
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EN
中文
